CHALLENGES AND OPPORTUNITIES IN ELECTROCHEMICAL ATOMIC LAYER DEPOSITION OF NOBLE METALS

Abstract

Electrochemical Atomic Layer Deposition (E-ALD) is a promising technique for depositing noble metals with atomic-level precision. However, like any emerging technology, it presents several challenges that must be addressed to fully exploit its potential. This study investigates the challenges and opportunities of Electrochemical Atomic Layer Deposition (E-ALD) of noble metals. The study identifies three major challenges in the E-ALD process, including control of deposition process, electrodeposition mechanism, and adhesion and stability. The control of the deposition process requires precise adjustment of deposition conditions to avoid defects and non-uniformity. The mechanism of electrodeposition of noble metals is complex and requires further investigation for the development of reliable and reproducible E-ALD processes. The adhesion and stability of the deposited layer on the substrate under different environmental conditions is another challenge that needs to be addressed. The study also reveals significant opportunities offered by E-ALD. The atomic-level precision of E-ALD can enable the fabrication of new materials with unique properties and functionalities. The versatility of E-ALD allows for the deposition of noble metals on a wide range of substrates, including metals, semiconductors, and insulators. E-ALD is also a cost-effective technique for depositing noble metals, as it uses a small amount of precursor and achieves high coverage with low thickness. This reduces the cost of materials and processing time, making E-ALD an attractive technique for various applications.